ITE Equipment
Equipment available at ITE
For general enquiries, contact: Technology Development Centre (TDC) at cc_tdc@ite.edu.sg
ITE Equipment Directory. Equipment, descriptions, and keywords. Equipment available at ITE for research and collaboration.
Equipment | Description | Keywords |
|---|---|---|
IT200LV SEM (JEOL) | SEM with EDX | SEM, EDX |
UAG-IC Universal Tester (Shimadzu) | 100kN Tensile Tester | Tensile tester |
Q20 DSC (TA) | Differential Scanning Calorimetry | DSC |
Q400 TMA (TA) | Thermo Mechanical Analyser | TMA |
Q50 TGA (TA) | Thermogravimetry Gravimetry Analyser | TGA |
DMA1 (METTLER TOLEDO) | Dynamic Mechanical Analyser | DMA |
HMV-G20S (SHIMADZU) | Micro Vickers Hardness Tester | Vickers Micro Hardness |
DAGE 5000 (DAGE) | Bond tester for microelectronics. Wire bond pull test, ball shear, die shear | Ball bond tester, wire bond pull tester, die shear tester |
HI5522 (HANNA) | pH meter, electrical conductivity tester | pH meter, electrical conductivity tester |
VISCOQC 100 (ANTON PARR) | Rotational viscometer | Viscometer |
XD 6600 X-RAY (DAGE) | X-ray inspection system | X-ray |
EDDY CURRENT ELECTRICAL CONDUCTIVITY METER (FOERSTER) | Electrical conductivity meter for non-ferrous metal | Electrical conductivity meter |
STM-6 MEASUREING MICROSCOPE (OLYMPUS) | Tool maker measuring microscope | measuring microscope |
TCC-150W (ESPEC) | Temperature Cycling Chamber | temperature cycling chamber, reliability |
SH-222 (ESPEC) | Temperature humidity chamber | temperature humidity chamber, reliability |
PC-242HS-A/V (HIRAYAMA) | Pressure cooker test chamber, 121 degC, 100%RH, 2atm, | PCT, reliability |
MAT6400 (MAT) | Flip chip bonder | flip chip bonder, semicon |
BM-W630 (DEKTEC) | 6-zone reflow oven | reflow oven, semicon |
AM410 (ANT SCIENTIFIC) | Planetary Ball miller | planetary ball miller |
J35 PRO (STRATASYS) | 3D printer | 3d printer |
MILLING MACHINE | Milling machine for fabrication | milling, drilling, fabrication |
METAL-X (MARKFORGE) | Metal 3D printer | metal 3d printer |